As AI accelerates computing demands, traditional air cooling can no longer meet thermal requirements efficiently.

Direct-to-chip liquid cooling offers a revolutionary solution by removing heat directly from processors through a sophisticated four-stage cooling process:

• Within cold plates, coolant absorbs heat directly from processors through micro-channels.

• Within servers, sealed piping networks distribute coolant across high-power components.

• Within racks, CDUs and manifolds manage cooling across multiple servers.

• Within premises, heat transfers through exchangers to cooling towers for atmospheric rejection.

Key benefits:

• 40% reduction in electricity costs.

• Up to 25x better heat transfer than air.

• 80% reduction in data center space.

• One-year ROI on facility investment.

• Enables ~1kW AI processors.

A Visual Guide

Benefits

How it works

From Chip to Tower

More / Resources @Supermicro:

• Supermicro Liquid Cooling Solutions Overview

• White Paper – Liquid Cooling Solutions

• Datasheet – Direct To Chip – Liquid Cooling Components

• White Paper – Direct Liquid Cooling – Power Savings Analysis