As AI accelerates computing demands, traditional air cooling can no longer meet thermal requirements efficiently.
Direct-to-chip liquid cooling offers a revolutionary solution by removing heat directly from processors through a sophisticated four-stage cooling process:
• Within cold plates, coolant absorbs heat directly from processors through micro-channels.
• Within servers, sealed piping networks distribute coolant across high-power components.
• Within racks, CDUs and manifolds manage cooling across multiple servers.
• Within premises, heat transfers through exchangers to cooling towers for atmospheric rejection.
Key benefits:
• 40% reduction in electricity costs.
• Up to 25x better heat transfer than air.
• 80% reduction in data center space.
• One-year ROI on facility investment.
• Enables ~1kW AI processors.
A Visual Guide
Benefits
How it works
From Chip to Tower
More / Resources @Supermicro:
• Supermicro Liquid Cooling Solutions Overview
• White Paper - Liquid Cooling Solutions
• Datasheet - Direct To Chip - Liquid Cooling Components
• White Paper - Direct Liquid Cooling - Power Savings Analysis
